BEIJING, July 21 (TMTPOST) — Taiwan Semiconductor Manufacturing Company (TSMC) has decided to build its first chip production plant in Japan in 2023, sources familiar with the matter said. The company’s board believes that a final decision will be made within this quarter. The chip production plant will mainly supply image sensors to TSMC’s biggest Japanese client Sony. The plant will adopt 28nm processing technology, which is mainly used in manufacturing components for vehicles and consumer products. It is said that the plant will have a monthly output of around 40,000 wafers. Sony has declined to comment on this report.